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| MEMS and Nano technology for Surface |
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- 0pto Semiconductors
- Full Automatic Wafer Back Grinding System
- Full Automatic multi-wafer Bonding System
- Sapphire Wafer Mass Production Solution
- Ultra Precision Polishing
- CMP Solution / MEMS
- IC Pad Manufacturing Solution
- Fully Automatic Surface Milling , 3D Engraving System
- Dicing System
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Full Automatic CNC vertical grinding system(Sapphire Wafer back grinding) |
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Multi wafer process of sapphire |
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Surface microfinishing and planarization |
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Wafer MEMS processing device, process |
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GaN wafer backgrinding & polising |
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